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UW Engineering Receives $12 Million Gift to Advance Innovation in Key Tech Fields

The University of Washington's College of Engineering has announced a significant $12 million gift from Winbond Electronics Corporation America, establishing the Winbond Endowed Fund for Excellence. This fund aims to bolster research, education, and innovation, with a focus on areas like semiconductors, AI, and quantum technologies, directly impacting students, faculty, and the broader community.

By Dr. Matthew Lynch · October 14, 2026 · 4 min read

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